Aulia, A.F. et al. 2026. Effect of Current Density, Surfactants, and CuSO4 Concentration on Copper Electroplating of Iron Surfaces. IPTEK The Journal of Engineering. 12, 1 (Aug. 2026), 12–28. DOI:https://doi.org/10.12962/j28075064.v12i1.9683.