AULIA, Anisa Fatma; FAIZAH, Nurul; THUFAILAH, Gladys Sukma. Effect of Current Density, Surfactants, and CuSO4 Concentration on Copper Electroplating of Iron Surfaces. IPTEK The Journal of Engineering, [S. l.], v. 12, n. 1, p. 12–28, 2026. DOI: 10.12962/j28075064.v12i1.9683. Disponível em: https://journal.its.ac.id/index.php/joe/article/view/9683. Acesso em: 17 aug. 2026.